Firan Technology Group (TSE:FTG) PT Raised to C$7.00 at Acumen Capital

Firan Technology Group (TSE:FTGGet Free Report) had its price objective upped by equities researchers at Acumen Capital from C$6.00 to C$7.00 in a research report issued on Monday, BayStreet.CA reports. The brokerage presently has a “buy” rating on the stock. Acumen Capital’s target price would suggest a potential upside of 29.87% from the stock’s current price.

Firan Technology Group Trading Up 1.5 %

TSE FTG opened at C$5.39 on Monday. Firan Technology Group has a 52 week low of C$3.02 and a 52 week high of C$6.14. The company has a 50 day moving average price of C$5.48 and a 200 day moving average price of C$4.49. The company has a quick ratio of 1.53, a current ratio of 2.24 and a debt-to-equity ratio of 58.33. The firm has a market cap of C$128.66 million, a PE ratio of 11.23 and a beta of 1.47.

Firan Technology Group (TSE:FTGGet Free Report) last issued its quarterly earnings results on Thursday, April 11th. The company reported C$0.04 earnings per share (EPS) for the quarter. Firan Technology Group had a return on equity of 21.58% and a net margin of 8.60%. The business had revenue of C$34.98 million for the quarter. As a group, sell-side analysts forecast that Firan Technology Group will post 0.34 EPS for the current fiscal year.

Insiders Place Their Bets

In other news, Director Mike Andrade bought 11,000 shares of the business’s stock in a transaction that occurred on Tuesday, April 16th. The shares were purchased at an average cost of C$5.39 per share, with a total value of C$59,290.00. Corporate insiders own 34.10% of the company’s stock.

Firan Technology Group Company Profile

(Get Free Report)

Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe, and rest of Americas. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.

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